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Cost-effective Solution for Producing:
¨ Known-Good-Die (KGD) for
MultiChip Packages
¨ Zero-defect automotive ICs
• Production Proven Full-Wafer Burn-In
Solution:
¨ Protects wafers and probe cards
with individual power channel overcurrent
protection
¨ High volume production capacity —
15 wafers per load
• Reduces Costs:
¨ Reduces burn-in times by enabling
higher burn-in temperatures
¨ Reduces final test costs by
functionally testing wafer during
burn-in
¨ Saves packaging costs by deferring
until after burn-in
¨ Highly reliable — 4th generation
design
